Shelding mesh design for an integrated circuit device

ABSTRACT

Methods and apparatuses to design an Integrated Circuit (IC) with a shielding of wires. In at least one embodiment, a shielding mesh of at least two reference voltages (e.g., power and ground) is used to reduce both the capacitive coupling and the inductive coupling in routed signal wires in IC chips. In some embodiments, a type of shielding mesh (e.g., a shielding mesh with a window surrounded by a power ring, or a window with a parser set of shielding wires) is selected to make more routing area available in locally congested areas. In other embodiments, the shielding mesh is used to create or add bypass capacitance. Other embodiments are also disclosed.

This application is a divisional of U.S. patent application Ser. No.11/305,425, filed Dec. 16, 2005, now U.S. Pat. No. 7,739,624 which is acontinuation-in-part of U.S. patent application Ser. No. 10/626,031,filed Jul. 23, 2003, now U.S. Pat. No. 7,943,436 which is related to andclaims the benefit of the filing date of U.S. provisional applicationSer. No. 60/399,760, filed Jul. 29, 2002, and entitled “Method andApparatus for Designing Integrated Circuit Devices with Shielding” bythe inventor Kenneth S. McElvain.

FIELD OF THE INVENTION

The invention relates to designing integrated circuits, and moreparticularly to shielding wires from capacitive and inductive coupling.

BACKGROUND OF THE INVENTION

Integrated Circuits (ICs) are used in numerous applications, such ascellular phones, wristwatch cameras, and hand-held organizers, andothers. As the commercial markets and consumer demands for smallerIntegrated Circuits grow, IC size requirement trends continue towards asmall form factor and lowered power consumption.

For the design of digital circuits on the scale of VLSI (very largescale integration) technology and beyond, designers often employcomputer aided techniques. Standard languages such as HardwareDescription Languages (HDLs) have been developed to describe digitalcircuits to aide in the design and simulation of complex digitalcircuits. Several hardware description languages, such as VHDL andVerilog, have evolved as industry standards. VHDL and Verilog aregeneral purpose hardware description languages that allow definition ofa hardware model at the gate level, the register transfer level (RTL) orthe behavioral level using abstract data types. As device technologycontinues to advance, various product design tools have been developedto adapt HDLs for use with newer devices and design styles.

In designing an integrated circuit with an HDL code, the code is firstwritten and then compiled by an HDL compiler. The HDL source codedescribes at some level the circuit elements, and the compiler producesan RTL netlist from this compilation. The RTL netlist is typically atechnology independent netlist in that it is independent of thetechnology/architecture of a specific vendor's integrated circuit, suchas field programmable gate arrays (FPGA) or an application-specificintegrated circuit (ASIC). The RTL netlist corresponds to a schematicrepresentation of circuit elements (as opposed to a behavioralrepresentation). A mapping operation is then performed to convert fromthe technology independent RTL netlist to a technology specific netlistwhich can be used to create circuits in the vendor'stechnology/architecture. It is well known that FPGA vendors utilizedifferent technology/architecture to implement logic circuits withintheir integrated circuits. Thus, the technology independent RTL netlistis mapped to create a netlist which is specific to a particular vendor'stechnology/architecture.

One operation, which is often desirable in this process, is to plan thelayout of a particular integrated circuit and to control timing problemsand to manage interconnections between regions of an integrated circuit.This is sometimes referred to as “floor planning.” A typical floorplanning operation divides the circuit area of an integrated circuitinto regions, sometimes called “blocks,” and then assigns logic toreside in a block. These regions may be rectangular or non-rectangular.This operation has two effects: the estimation error for the location ofthe logic is reduced from the size of the integrated circuit to the sizeof the block (which tends to reduce errors in timing estimates), and theplacement and the routing typically runs faster because as it has beenreduced from one very large problem into a series of simpler problems.

As the IC size shrinks, semiconductor manufacturers are forced to designcircuits at a much smaller level than in the past. Previously, as theindustry moved from Very Large Scale Integration (VLSI) to Ultra LargeScale Integration (ULSI), the relative capacitive and inductive couplingof the circuit itself was not realized to be as critical of an issue.

However, when the semiconductor industry designs and implementscircuitry based on the sub-micron level technology and beyond, wherespacing between circuitry lines is less than 10-6 microns, thecapacitive and inductive coupling of the signal lines within thecircuitry itself is realized to be a critical problem for designers. Ascircuit size becomes smaller and the lengths of signal lines becomelonger relative to the width of the lines, the problem of couplingand/or cross talk between signal lines and ground or power lines becomesmore evident. Furthermore, as the signal line to ground (and/or othersignal lines) coupling becomes stronger, the signal to noise ratio for agiven signal decreases proportionally. This particular issue ofcapacitive and inductive coupling in signals is becoming increasinglydifficult as the industry advances and moves towards reduction incircuit device size (for example, from 0.25 micron technology to 0.18micron, 0.15 micron, 0.13 micron and beyond).

One approach to increase the signal to noise ratio (e.g., with respectto the noise caused by capacitive and inductive coupling from adjacentsignal lines) is to strengthen the signal drive level. By increasing thesignal strength, the signal to noise ratio for the signal is improved.Unfortunately, to increase the signal strength, the device must also besupplied with higher power, which is inconsistent with the requirementof reducing power consumption in ICs for heat issues, portability issuesand environmental issues. In addition to the higher power consumption,increasing the signal strength does not eliminate signal coupling. Thesignal of increased strength may cause increased noise in the adjacentsignal lines through capacitive and inductive coupling.

Another approach is to reduce the effective (R-L-C) impedance of thesignal lines by increasing the spacing between signal lines, which isusually combined with the approach of strengthen the signal drive level,to reduce coupling and to improve signal to noise ratio. In general,when the spacing between the signal lines is increased by three-fold,the coupling effect is reduced by fifty percent. However, increasing thespacing is inconsistent with the requirement for circuit compactness.

Another approach is to insert buffers/repeaters to keep the wires short,reducing resistance and coupling capacitance. This approach works for amoderate number of signals, where an excessive number ofbuffers/repeaters are not required.

Another approach is to shield the signal lines by using either a supplyvoltage (e.g., VDD) or ground. The shielding line (ground) is wideenough to have low impedance so that the shielding line itself does nottransfer the noise to other signal lines. FIG. 2 shows a top view ofshielding lines and signal lines. A signal line (e.g., line 201 or 205)is routed along with a shielding line (e.g., line 203 or 207), which isconnected to a supplied voltage or ground to shield the noise from aneighbor signal line. For sub-micron technologies, the lengths of thesesignal lines and shielding lines can be relatively long with respect totheir width. When the path is long, the shielding wires becomeresistive; and, coupling can take place across the shielding wires tothe next neighbor, which tends to reduce the signal to noise ratio orincrease cross talk within the circuit on a given substrate.

The above approaches have a lower area and performance cost, but requireexpensive analyses, which are often questionable, to show that thesignal integrity of the wires in the IC is preserved.

SUMMARY OF THE DESCRIPTION

Methods and apparatuses to design an Integrated Circuit (IC) with ashielding of wires of at least two different voltages are describedhere. In one aspect of the invention, an exemplary method for designingan integrated circuit includes determining at least one temperature ofan integrated circuit and inserting, in response to the determining, arepresentation of a shielding mesh into at least one layer of theintegrated circuit. In one implementation of this method, a plurality oftemperatures may be determined at a plurality of different locations onthe integrated circuit. This plurality of temperatures represents atemperature profile, and the shielding mesh is capable of reducing avariation of temperatures in the temperature profile.

In another aspect of the invention, an exemplary method for designing anintegrated circuit includes introducing at least one shielding mesh intoa representation of a design of the integrated circuit and routingrepresentations of signal lines in the shielding mesh prior to anoptimization which determines whether signal lines should be shielded.

In another aspect of the invention, an exemplary method for designing anintegrated circuit includes creating a representation of a shieldingmesh and a representation of a design of the integrated circuit, whereinthe shielding mesh comprises a first single layer shielding mesh and afirst double layer shielding mesh which is coupled to the first singlelayer shielding mesh, and the method also includes creating arepresentation of a second shielding mesh having at least a first layerand having a first set of lines which are diagonally oriented relativeto a second set of lines in the first single layer shielding mesh andare diagonally oriented relative to a third set of lines in the firstdouble layer shielding mesh.

In another aspect of the invention, an exemplary method for designing anintegrated circuit includes creating a representation of a shieldingmesh in a representation of a design of the integrated circuit, whereinthe shielding mesh includes a first single layer shielding mesh and afirst double layer shielding mesh which is coupled to the first singlelayer shielding mesh, and creating a representation of aninterconnection device coupled between a first line in one of the layersof the first double layer shielding mesh and a further line which isrouted through the first double layer shielding mesh.

In another aspect of the invention, an exemplary method for designing anintegrated circuit includes generating a representation of a shieldingmesh in at least one layer of a representation of a design of theintegrated circuit, wherein the shielding mesh has a first plurality oflines which are designed to provide a first reference voltage and has asecond plurality of lines which are designed to provide a secondreference voltage, and wherein the shielding mesh also includes a windowin which signal lines are routed with less shielding than signal lineswhich are routed in the shielding mesh. The method further includesgenerating a representation of power supply lines in at least a furtherlayer of the representation of the integrated circuit, wherein thefurther layer is different than the at least one layer which containsthe shielding mesh, and the power supply lines are coupled to theshielding mesh and are larger in width than the first plurality of linesand the second plurality of lines.

In another aspect of the invention, an exemplary method for designing anintegrated circuit includes creating a representation of a shieldingmesh in a representation of a design of the integrated circuit, whereinthe shielding mesh includes at least one layer having a first pluralityof lines which are designed to provide a first reference voltage, andthe first layer has a second plurality of lines, which are designed toprovide a second reference voltage, and wherein at least one of thefirst plurality of lines or the second plurality of lines has anopening, and the method further includes creating a representation of asignal line disposed in the shielding mesh, wherein the signal line hasan enlarged portion adjacent to the opening and has at least twoconnection vias which electrically couple the signal line to a conductoron another layer.

In another aspect of the invention, an exemplary method includessearching for at least one first signal line in a shielding mesh of arepresentation of the integrated circuit which does not requireshielding, and determining that at least one second signal line shouldbe shielded in the shielding mesh and placing the at least one secondsignal line into the shielding mesh and removing the at least one firstsignal line from the shielding mesh.

In one aspect of the invention, an exemplary method for designing anintegrated circuit (IC) includes determining a desired amount ofdecoupling capacitance in a representation of a design of the IC,routing signal lines in at least one layer of a shielding mesh of therepresentation (the routing taking into account the desired amount ofdecoupling capacitance to provide a preserved space in the shieldingmesh for decoupling lines), and routing capacitive decoupling lines inthe shielding mesh, thereby using the preserved space.

In another aspect of the invention, an exemplary IC includes at leastone layer in the IC which includes a shielding mesh that has a firstplurality of lines designed to provide a first reference voltage (e.g.VSS) and a second plurality of lines designed to provide a secondreference voltage (e.g. VDD) and a plurality of signal lines routedthrough the shielding mesh, wherein each of the signal lines is disposedadjacent to at least one of the first plurality or the second pluralityof lines and wherein at least one of the first plurality of lines and atleast one of the second plurality of lines are adjacent to each other,without a signal line intervening, to provide a capacitive couplingbetween them.

In another aspect of the invention, an exemplary method for designing anIC includes creating a representation of at least one layer of said IC,the at least one layer having a repeating pattern of at least twoadjacent first plurality of lines (designed to provide a first referencevoltage, such as, e.g., VSS) and at least two adjacent second pluralityof lines (designed to provide a second reference voltage, such as, e.g.,VDD) and includes creating a representation of at least one signal linedisposed adjacent to at least one of the first or the second pluralityof lines. This method may further include creating a representation ofat least one additional line designed to carry said first referencevoltage and routed between an adjacent pair of lines of the secondplurality of lines, wherein this additional line creates a decouplingcapacitor between itself and the adjacent pair of lines.

In another aspect of the present invention, a method to design anIntegrated Circuit (IC) device includes: determining a shielding mesh ina substrate, which includes a first plurality of connected wires for afirst reference voltage and a second plurality of connected wires for asecond reference voltage; and routing a first portion of a firstplurality of signal wires in the substrate to shield the first portionof each of the first plurality of the signal wires between one of thefirst plurality of connected wires and one of the second plurality ofconnected wires from adjacent signal wires. A second portion of thefirst plurality of signal wires are adjacent to each other in a regiondefined by the first and second pluralities of connected wires. Thisregion may be a window. In one example, the wires of the shielding meshare interconnected such that an average length of segments of the firstand second pluralities of connected wires between nodes each of whichjoins more than two wires in the shielding mesh is substantially lessthan an average length of the first plurality of signal wires. In oneexample, the first plurality of connected wires and the second pluralityof connected wires are in two layers in the substrate; a first pluralityof vias connect the first plurality of wires; a second plurality of viasconnect the second plurality of wires; and the first and secondpluralities of vias divide the first and second pluralities of connectedwires into segments that are substantially shorter than an averagelength of the first plurality of signal wires. In one example, the firstreference voltage is power; the second reference voltage is ground; andthe shielding mesh is used both to distribute power and to shield signallines from capacitive and inductive coupling.

In one embodiment of the present invention, the shielding mesh containsa window defined by a subset of the first and second pluralities ofconnected wires in a top view of the IC; a third plurality of signalwires are routed within the window without shielding. Each of the thirdplurality of signal wires are adjacent to at least one of the thirdplurality of signal wires without shielding in between. In one example,each of the subset of wires is substantially wider than the thirdplurality of signal wires so that the subset of wires form a power ringthat reduces the impedance in the shielding mesh caused by the window inshielding mesh. The window may be created as a result of a congestionanalysis which indicates a need for routing resources.

In one embodiment of the present invention, a second plurality of signalwires are routed in the substrate to shield each of the second pluralityof signal wires between two of the first plurality of connected wiresfrom adjacent signal wires. The second plurality of signal wires areless subjected to signal integrity problems than the first plurality ofsignal wires if routed without shielding; and the critical signal linesare routed between shielding wires of different voltages. In oneexample, the shielding mesh has tracks for routing signal lines betweenparallel shielding wires of the same voltage; these tracks can be usedto widen the shielding wires to increase the current carrying capacityof the shielding wires, if they are not used for signal lines. In oneexample, at least two of adjacent ones of the first plurality ofconnected wires are combined into one wider wire; in another example, anarea between two of the first plurality of connected wires is filled into generate one wider wire. Thus, some shielding wires are wider thanother shielding wires. For example, one shielding wire is wider than thecombined width of one of the first and second pluralities of connectedwires and one of the first plurality of signal wires. Alternatively,rather than widening an existing wire, an additional reference voltageline may be added. This additional reference voltage line may be thesame or different voltage as the surrounding wires.

In one example, a third plurality of signal wires are routed in a firstlayer in the substrate between first two wires of the first and secondpluralities of connected wires; the first two wires are substantiallywider than the third plurality of signal wires; the third plurality ofsignal wires are substantially parallel to each other; and each of thethird plurality of signal wires is adjacent to at least one of the thirdplurality of signal wires without shielding in between. Thus, the firsttwo wires define a first window in the shielding mesh within which atleast some signal lines are not shielded in the first layer. Further, afourth plurality of signal wires are routed in a second layer in thesubstrate with second two wires of the second and second pluralities ofconnected wires; the second two wires are substantially wider than thefourth plurality of signal wires; the fourth plurality of signal wiresare substantially parallel to each other; and each of the fourthplurality of signal wires is adjacent to at least one of the fourthplurality of signal wires without shielding in between. Thus, the secondtwo wires define a second window within which at least some signal linesare not shielded in the second layer. In one example, the first andsecond windows substantially coincide with each other in a top view ofthe IC. In another example, there is only one window for unshieldedsignal wires in one of the layers. In one example, an allowableunshielded length of a signal line that can be unshielded by theshielding mesh is determined; and the signal line is routed with aportion of the signal line unshielded by the shielding mesh shorter thanthe allowable unshielded length.

In one embodiment of the present invention, the first and secondpluralities of connected wires of the shielding mesh are routed within aregion defined by an IP block, which is described below, in a top viewof the IC. Some of the first plurality of signal wires are a part of theIP block; and some of the first plurality of signal wires are not a partof the IP block. In one example, at least one of the first plurality ofsignal wires that is not a part of the IP block is within a regiondefined by the IP block in a top view of the IC. In one example, atleast one of the first plurality of signal wires that is a part of theIP block is re-routed in the shielding mesh.

The present invention includes apparatuses which perform these methods,including data processing systems which perform these methods andcomputer readable media which when executed on data processing systemscause the systems to perform these methods. The present invention alsoincludes IC devices designed according to these methods or having thefeatures described herein.

Other features of the present invention will be apparent from theaccompanying drawings and from the detailed description which follow.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example and notlimitation in the figures of the accompanying drawings in which likereferences indicate similar elements.

FIG. 1 shows a block diagram example of a data processing system whichmay be used with the present invention.

FIG. 2 shows a top view of shielding lines and signal lines.

FIG. 3 shows a top view of signal lines shielded by a two-layershielding mesh according to one embodiment of the present invention.

FIG. 4 shows a perspective view of signal lines shielded by a two-layershielding mesh according to one embodiment of the present invention (theinsulating layer between the two-layer shielding mesh is not shown).

FIG. 5 shows a vertical cross-sectional view of signal lines shielded bya multi-layer shielding mesh according to one embodiment of the presentinvention.

FIGS. 6-10 show examples of shielding meshes for shielding signal lineswithin a layer according to embodiments of the present invention.

FIGS. 11-13 show detailed examples of signal lines shielded by two-layershielding meshes according to embodiments of the present invention.

FIG. 14 shows a detailed example of a two-layer shielding meshesconnected with a power grid according to one embodiment of the presentinvention.

FIG. 15 shows a perspective view of a two-layer shielding mesh with awindow for unshielded signal lines according to one embodiment of thepresent invention.

FIGS. 16-18 shows in top views detailed examples of two-layer shieldingmeshes with windows for unshielded signal lines according to embodimentsof the present invention.

FIG. 19 shows an example of signal lines routed in the presence of an IPblock without a shielding mesh.

FIGS. 20-21 shows examples of signal lines routed through a region foran IP block in a shielding mesh according to embodiments of the presentinvention.

FIG. 22 shows a flow diagram of designing an integrated circuitaccording to one embodiment of the present invention.

FIG. 23 shows a method to route signal lines for an integrated circuitaccording to one embodiment of the present invention.

FIG. 24 shows a method to route signal lines in a shielding meshaccording to one embodiment of the present invention.

FIG. 25 shows a method to route signal lines in a shielding mesh with awindow for unshielded lines according to one embodiment of the presentinvention.

FIG. 26 shows a method to route unshielded or partially shielded signallines in a window of a shielding mesh according to one embodiment of thepresent invention.

FIG. 27 shows a method to route signal lines through a region of apre-designed block of circuit in a shielding mesh according to oneembodiment of the present invention.

FIG. 28A shows a top view of a shielding mesh of another exemplaryembodiment of the invention.

FIG. 28B shows a top view of the shielding mesh of FIG. 28A after asignal line is routed in the mesh and after an additional voltagereference line, for decoupling capacitance, has been routed in the mesh.

FIG. 29A shows a top view of another shielding mesh.

FIG. 29B shows a top view of the shielding mesh of FIG. 29A after signallines have been routed in the mesh and after additional voltagereference lines, for decoupling capacitance, have been routed in themesh.

FIG. 30 shows a top view of a two layer shielding mesh (without showingan intervening insulating layer) which is similar to the shielding meshof FIG. 12.

FIG. 31 is a flow chart showing one exemplary method of designing an IC.

FIG. 32 shows a top view of two layers of a shielding mesh relative totwo other layers (such as two other metal layers, e.g. “metal 2” and“metal 3” layers).

FIG. 33 shows a top view of another embodiment of a shielding meshhaving two layers in portions of the shielding mesh and having one layerin other portions.

FIGS. 34A and 34B show a top view of a shielding mesh which changes inthe process of designing an IC, according to another embodiment.

FIG. 35 is a flow chart which shows an exemplary method of designing anIC according to another aspect of the invention.

FIG. 36 shows another exemplary method for designing an IC according toanother aspect of the invention.

FIG. 37 shows another exemplary embodiment of a shielding mesh in twolayers of an IC.

FIG. 38 shows another exemplary embodiment of a shielding mesh in twolayers of an IC.

FIG. 39 shows another exemplary embodiment of shielding meshes in an IC.

FIG. 40 shows a multi-level, perspective view of two shielding meshesand two other layers with power lines which are used to feed power tothe two shielding meshes.

FIG. 41 shows another exemplary embodiment of shielding meshes in an IC.

FIG. 42 shows a multi-level, perspective view of two shielding meshesand another layer with power lines which are used to feed power to thetwo shielding meshes.

FIG. 43 shows another exemplary method for designing an IC according toanother aspect of the invention.

FIG. 44 shows another exemplary method for designing an IC according toanother aspect of the invention.

DETAILED DESCRIPTION

The following description and drawings are illustrative of the inventionand are not to be construed as limiting the invention. Numerous specificdetails are described to provide a thorough understanding of the presentinvention. However, in certain instances, well known or conventionaldetails are not described in order to avoid obscuring the description ofthe present invention.

Many of the methods of the present invention may be performed with adigital processing system, such as a conventional, general purposecomputer system. Special purpose computers which are designed orprogrammed to perform only one function may also be used.

FIG. 1 shows one example of a typical computer system which may be usedwith the present invention. Note that while FIG. 1 illustrates variouscomponents of a computer system, it is not intended to represent anyparticular architecture or manner of interconnecting the components assuch details are not germane to the present invention. It will also beappreciated that network computers and other data processing systemswhich have fewer components or perhaps more components may also be usedwith the present invention. The computer system of FIG. 1 may, forexample, be an Apple Macintosh computer or a computer system which runsa Windows or UNIX operating system.

As shown in FIG. 1, the computer system 101, which is a form of a dataprocessing system, includes a bus 102 which is coupled to amicroprocessor 103 and a ROM 107 and volatile RAM 105 and a non-volatilememory 106. The microprocessor 103, which may be a G3 or G4microprocessor from Motorola, Inc. or IBM is coupled to cache memory 104as shown in the example of FIG. 1. The bus 102 interconnects thesevarious components together and also interconnects these components 103,107, 105, and 106 to a display controller and display device 108 and toperipheral devices such as input/output (I/O) devices which may be mice,keyboards, modems, network interfaces, printers, scanners, video camerasand other devices which are well known in the art. Typically, theinput/output devices 110 are coupled to the system through input/outputcontrollers 109. The volatile RAM 105 is typically implemented asdynamic RAM (DRAM) which requires power continually in order to refreshor maintain the data in the memory. The non-volatile memory 106 istypically a magnetic hard drive or a magnetic optical drive or anoptical drive or a DVD RAM or other type of memory systems whichmaintain data even after power is removed from the system. Typically,the non-volatile memory will also be a random access memory althoughthis is not required. While FIG. 1 shows that the non-volatile memory isa local device coupled directly to the rest of the components in thedata processing system, it will be appreciated that the presentinvention may utilize a non-volatile memory which is remote from thesystem, such as a network storage device which is coupled to the dataprocessing system through a network interface such as a modem orEthernet interface. The bus 102 may include one or more buses connectedto each other through various bridges, controllers and/or adapters as iswell known in the art. In one embodiment the I/O controller 109 includesa USB (Universal Serial Bus) adapter for controlling USB peripherals,and/or an IEEE-1394 bus adapter for controlling IEEE-1394 peripherals.

It will be apparent from this description that aspects of the presentinvention may be embodied, at least in part, in software. That is, thetechniques may be carried out in a computer system or other dataprocessing system in response to its processor, such as amicroprocessor, executing sequences of instructions contained in amemory, such as ROM 107, volatile RAM 105, non-volatile memory 106,cache 104 or a remote storage device. In various embodiments, hardwiredcircuitry may be used in combination with software instructions toimplement the present invention. Thus, the techniques are not limited toany specific combination of hardware circuitry and software nor to anyparticular source for the instructions executed by the data processingsystem. In addition, throughout this description, various functions andoperations are described as being performed by or caused by softwarecode to simplify description. However, those skilled in the art willrecognize what is meant by such expressions is that the functions resultfrom execution of the code by a processor, such as the microprocessor103.

A machine readable media can be used to store software and data whichwhen executed by a data processing system causes the system to performvarious methods of the present invention. This executable software anddata may be stored in various places including for example ROM 107,volatile RAM 105, non-volatile memory 106 and/or cache 104 as shown inFIG. 1. Portions of this software and/or data may be stored in any oneof these storage devices.

Thus, a machine readable media includes any mechanism that provides(i.e., stores and/or transmits) information in a form accessible by amachine (e.g., a computer, network device, personal digital assistant,manufacturing tool, any device with a set of one or more processors,etc.). For example, a machine readable media includesrecordable/non-recordable media (e.g., read only memory (ROM); randomaccess memory (RAM); magnetic disk storage media; optical storage media;flash memory devices; etc.), as well as electrical, optical, acousticalor other forms of propagated signals (e.g., carrier waves, infraredsignals, digital signals, etc.); etc.

In at least one embodiment of the present invention, a shielding mesh ofat least two reference voltages (e.g., power and ground) is used toreduce both capacitive coupling and inductive coupling in signal wiresin IC chips. According to one embodiment of the present invention, acircuit device with a plurality of signal lines disposed within asubstrate has a shielding mesh of wires connected to provide power tothe circuitry of the substrate circuit and to shield signal lines fromeach other to reduce the effects of cross talk between nearby signallines within the circuit device.

It is understood that in this application the width of a wire or linerefers to the shorter dimension of the wire parallel to the layer forthe wire; and the thickness of a wire refers to the dimension of thewire in a direction that is perpendicular to the layer.

FIG. 3 shows a top view of signal lines shielded by a two-layershielding mesh according to one embodiment of the present invention;and, FIG. 4 shows a perspective view of the signal lines shielded by thetwo-layer shielding mesh. According to this embodiment, a signal line isshielded on both sides by a shielding mesh connected to referencevoltages GND (ground) and VCC (power). Lines 311-315 are on one layer ofan IC; and lines 321-325 are on another layer of the IC. Lines 311 and321, connected by via 301, provide shielding at voltage GND; and, lines315 and 325, connected by via 303, provide shielding at voltage VCC.Signal line 313 is shielded at both sides by lines 311 and 315 ofdifferent voltages; and signal line 323 is shielded at both sides bylines 321 and 325. The lines in the two layers are running in an angle(e.g., 90 degrees, 45 degrees, or an acute angle or an angle other than90 degrees) so that one shielding line in one layer can be connected toseveral shielding lines in another layer through vias. For example, vias301 and 303 connects lines 321, 311 and lines 315 and 325 to form twointerwoven meshes, each of which is a mesh of wires interconnectedthrough vias and energized by one or more reference voltages (e.g., GNDor VCC).

In accordance with one embodiment of the present invention the shieldingmesh is included on an IC in addition to a power grid used to supplypower and ground to the circuitry. According to another embodiment, forexample in a 0.25 micron technology, the relative segment distance ofthe VDD and VSS lines may be reduced to as small as 0.94 micron.Reducing the segment lengths of shielding lines reduces their effectiveRC component and the coupling effects which are the sources of noises.

Due to close proximity of the shielding lines coupled with the fact thatthe shielding lines are of relatively short segments (e.g., due toconnections at vias 311 and 303), the effective RC impedance, as well asthe signal coupling between signal lines, is reduced. In one embodimentof the present invention, the width of the signal lines is the same asthe width of the shielding lines; in other embodiments of the presentinvention, the widths of some of the shielding lines are different fromthat of the typical signal lines. The density of lines in a shieldingmesh depend on the IC and the application and purpose of the meshrelative to the IC. In one case, the reference voltage lines (e.g. VSSand VDD) may be as dense as at least two reference voltage lines in adistance of less than 1 micron; in other words, a distance separatingtwo adjacent reference voltage lines may be less than 1 micron and thedensity in an area may be higher than 10 lines in a 10 micron by 10micron area. The density of all lines in the mesh in this case(including signal lines routed between reference voltage lines and anyadditional reference voltage lines which are added into the mesh fordecoupling capacitance purposes) is even higher than 10 lines in a 10micron by 10 micron area. The widths of these lines also depend on theIC and the application and purpose of the line. The signal lines mayhave a width as small as the currently available technology allows (e.g.smaller than 0.5 microns or smaller) and the width of the referencevoltage lines may be as small.

In one embodiment of the present invention, a single layer shieldingmesh has a plurality of shielding wires of different reference voltagesfor shielding a plurality of signal lines from each other.

FIG. 5 shows a vertical cross-sectional view of signal lines shielded bya multi-layer shielding mesh according to one embodiment of the presentinvention. Layers 371, 373 and 375 separate the layers on which lines381, 383, 363 and 365 are located respectively. Within each layer, onlyone signal line is routed between two reference voltage lines. Forexample, signal line 361 is shielded on the layer by reference voltagelines 363 and 367, which are for reference voltages VSS and VDDrespectively. Reference voltage lines may also shield a signal lineacross the layers. For example, reference voltage lines 369 and 365 mayprovide inter-layer shielding for signal line 361. The lines on layers371, 373 and 375 at the cross-sectional cut can be for VSS, Signal andVDD (or, Signal/VDD/Signal, VSS/Signal/VDD and Signal/VSS/Signal)respectively so that a signal line on one layer is shielded by one ormore lines of reference voltages in other layers. In one embodiment ofthe present invention, the signal lines and reference voltage lines indifferent layers are all aligned to form a grid structure (e.g., betweenlayers 371 and 375) where lines in a first layer are parallel within thelayer and extend in one direction (e.g. from left to right) and lines inanother layer are parallel within the another layer but areperpendicularly arranged relative to the first layer; in otherembodiments of the present invention, the signal lines and referencevoltage lines for different layers are not all aligned to a gridstructure (e.g., the layers above and below layer 371). The shieldinglines are of the same width in one embodiment; the shielding lines canbe of different widths in other embodiments, as illustrated by the crosssections of lines 381 and 383. Vias (e.g., vias 377, 379) are used tointerconnect the wires on different layers, especially the wires ofreference voltages to reduce the segment sizes of the shielding wires.In one embodiment of the present invention, the shielding lines ofdifferent voltages (e.g., VSS and VDD) are on alternating locations inthe shielding mesh so that each signal line are shielded between twoclosest adjacent lines which are of different reference voltages andwhich are parallel to the signal line in a layer or across severallayers).

In one embodiment of the present invention, vias of varying sizes areutilized in as close proximity as possible without dependency of gridsize. Utilizing the close proximity of the vias, relative segmentlengths of each signal shielded in the shielding mesh are reduced.

According to another embodiment of the present invention, the shieldingmesh is utilized to provide a path for connecting an integrated circuitdevice to the main power grid. For example, line 383 taps into line 381through vias 379 and 377; and, line 381 is in turn connected to the mainpower grid.

In some embodiments of the present invention, a type of shielding meshis selected to make more routing area available in locally congestedareas, or to increase the ability of the shielding mesh to delivercurrent with low voltage drop.

FIGS. 6-10 show examples of shielding meshes for shielding signal lineswithin a layer according to embodiments of the present invention. It isunderstood that the reference voltage lines (e.g., lines 401, 405, 411,415) may have the same voltage, or have different voltages.

In FIG. 6, each signal line (e.g., line 403) is shielded by two adjacentparallel reference voltage lines (e.g., lines 401 and 405). In oneembodiment of the present invention, the two adjacent parallel referencevoltage lines for each of the signal lines are of different voltages(e.g., VCC and GND) such that the signal lines are in the sequence of: .. . , VCC, Signal, GND, Signal, VCC, . . . ; in other embodiments of thepresent invention, the pairs of adjacent parallel reference voltagelines for some signal lines are of the same voltage (e.g., in thesequence of: . . . , VCC, Signal, VCC, . . . GND, Signal, GND, . . . ).The sequence or the pattern of the lines can be selected according tothe congestion level in the area, the power distribution requirement,the noise level of the signal lines, and other parameters.

FIG. 7 shows a situation where some of the signal lines are onlyshielded from one side. Although signal line 413 is shielded from bothsides by reference voltage lines 411 and 415, line 419 is shielded onlyat the right hand side; and line 417 is shielded only at the left handside. For example, a sequence of VCC, Signal, GND, Signal, Signal, VCC,Signal, Signal, GND can be used for the example of FIG. 7; or a sequenceof VCC, Signal, VCC, Signal, Signal, GND, Signal, Signal, GND can beused for the example of FIG. 7. Such a shielding mesh can be used for arelatively congested area, where a large portion of the area is used forrouting signal wires. Signal lines that are not subjected to signalintegrity problems can be routed next to each other within two shieldinglines.

FIG. 8 shows a situation where some of the signals are only shieldedfrom one side and some of the signal lines are not shielded. Althoughsignal lines 423 and 427 are each shielded at the one side by referencevoltage lines 421 and 429, signal line 425 is not shielded. Such ashielding mesh can be used for a congested area to provide more areasfor routing signal wires. For example, a reference voltage line at thelocation of 425 is replaced with a signal line that does not causesignal integrity problems when routed between signal lines 423 and 427.This replacement of one reference voltage line, at a location such aslocation 425, with a signal line may be performed during automatedplacing and/or routing of components on an IC as part of the computeraided process of designing the IC and it may be performed as a result ofdetecting congestion in the computer aided routing process. In onescenario, signal line 425 has only a short segment running betweensignal lines 423 and 427 so that a large portion (in the lengthdirection) of signal lines 423 and 427 are still shielded betweenadjacent reference voltage lines from both sides. In another scenario,when the timing of signal lines 423-427 are such that coupling betweenlines 423 and 425 and coupling between lines 425 and 427 do not cause asignal integrity problem, signal line 425 is used as a shielding line toreduce the coupling between lines 423 and 427. An example of such atiming scenario is one where lines 423 and 427 switch states at aboutthe same time in a clock cycle and line 425 switches its state at adifferent time in the cycle.

FIG. 9 shows a situation where more than two reference voltage lines areused to separate two signal lines. For example, reference voltage lines435 and 437 separate signal lines 433 and 439. The extra voltage linesmay be used to reduce the impedance of the reference lines, or to changea line sequence or a pattern of the voltage reference lines. Such ashielding mesh can be used in a non-congested region, where more areascan be used for distribution power. In one scenario, segments of some ofthe reference voltages lines are reconnected to route signal lines,especially short signal lines, which do not have strong coupling withneighbor signal lines.

FIG. 10 shows a situation where the reference voltage lines are ofdifferent sizes. For example, wider lines 441 and 445 are used to shieldline 443, which may be a strong source of noise; and narrower referencevoltage line 449 is used to shield line 447. Lines 441 and 445 may begenerated by combining one or more adjacent tracks (between the lines)that are not used for routing signal lines.

The shielding meshes as shown in FIGS. 6-10 can be interconnectedthrough vias in different layers to form a multi-layer shielding mesh,such as the mesh as shown in FIG. 5.

In one example of the present invention, the shielding mesh within onelayer contains at least three parallel shielding wires for completelyshielding two or more signal lines, each of which is deposited (e.g.routed) between two shielding wires and shielded from any neighborsignal line. In another example of the present invention, the shieldingmesh within one layer contains more than five (or seven) parallelshielding wires. The shielding wires in the shielding mesh are energizedby more than one reference voltages (e.g., GND and VCC, which are alsoused for distributing power in the IC). In one embodiment of the presentinvention, shielding meshes in more than one layer are interconnected sothat the average length of the segments of the shielding wires betweennodes each of which joins more than two wires in the shielding mesh isnot very long (e.g., less than 10˜15 times the average spacing betweenthe signal lines within the mesh). In one embodiment of the presentinvention, the average length of the segments of the shielding wiresbetween nodes each of which joins more than two wires is less than 3times the average spacing between the signal lines within the mesh. Inone embodiment of the present invention, the average length of thesegments of the shielding wires between nodes each of which joints morethan two wires is substantially less than the average length of thesignal lines within the mesh.

FIGS. 11-13 show detailed examples of signal lines shielded by two-layershielding meshes according to embodiments of the present invention.

FIG. 11 is a top view of a shield mesh on two adjacent substrate layers.The insulating layer which separates these adjacent substrate layers isnot shown. Segments of signal lines (e.g., 501-506 (S1-S6)) are shieldedfrom each other between segments of reference voltage lines (e.g., 511,513, 515, 517, and others). Vias 521, 522 and 523 connect GND line 513in the upper layer to GND lines 515, 518 and 519 in the lower layerrespectively so that GND line 513 is split into small segments.Similarly, vias 524-527 connect VCC line 517 in the lower layer tocorresponding VCC lines in the upper layer (e.g., VCC line 511). Via 529connects the segment of signal line 501 in the lower layer to thesegment of signal line 501 in the upper layer. Each via for theshielding mesh provides a connection between layers and reduces thesegment size of the shielding mesh to reduce the effective R-C value. InFIG. 11, a mesh of connected wires for voltage level VCC and a mesh ofconnected wires for voltage level GND are interwoven to form a shieldingmesh, where each segment of the signal lines are shielded between twoparallel adjacent reference lines of different voltages (e.g., GND andVCC) from segments of other closest signal lines.

In one embodiment of the present invention, the reference voltage linesin each of the layers are straight lines aligned to form a regular grid;in another embodiment, the reference voltage lines in each of the layersare neither straight nor aligned to form a regular grid. In oneembodiment of the present invention, when the reference voltage linesand the signal lines are aligned to a grid, the reference voltage linesare on odd (or even) grid tracks; and the signal lines are routed on theeven (or odd) grid tracks. In one embodiment of the present invention,when the reference voltage lines and the signal lines are aligned to agrid across multiple layers, the tracks are so assigned that there is nosignal track directly on top of one another in parallel to avoid topbottom coupling. For example, if signals lines on layer N are on oddtracks, signals lines on layer N+2, which has the same routing directionas layer N, are routed on even tracks. This strategy causes the signallines to be shielded by opposite power/ground not only on the left andright sides, but also on the top and bottom sides. Thus, the segmentlengths are reduced; and the effective isolation between signal lines toreduce noise coupling is increased.

When the signal lines and shielding lines in a layer do not form aregular grid, the signal lines in one layer can be traced by shieldinglines within the layer and in adjacent layers to provide top and bottomshielding.

In one embodiment of the present invention, the initial shielding meshis designed (or selected) such that some shielding wires of the samereference voltage (e.g., VCC or GND) are placed next to each other. If atrack between shielding wires of the same reference voltage is unused,the space between them can be filled in for conducting the referencevoltage, which can dramatically improve the current carrying capacity ofthe shielding wire. Signal lines are routed between shielding wires ofdifferent voltages (e.g., a VCC/GND pair) to leave the tracks betweenpairs of shielding wires of a same reference voltages (e.g., a VCC/VCCpair, or a GND/GND pair) unused as much as possible. Signals lesssubjected to corruption can be routed between pairs of shielding wiresof a same reference voltage. Different patterns of shielding wires, suchas VCC, GND, VCC, GND, GND, VCC, GND, VCC, VCC, may be used fordifferent tradeoff between shielding and current carrying capacity.

FIG. 12 is a top view of a shield mesh on two adjacent substrate layerswhere reference voltage lines 551-556 in the upper layer are in thesequence of VCC, VCC, GND, GND, VCC, VCC. Two reference voltage lines ofthe same voltage are placed near each other. A signal line routedbetween two reference voltage lines of different voltages are bettershielded than a signal line routed between two reference voltage linesof the same voltage. Thus, critical signal lines (e.g., signal line 561)are first routed between reference voltage lines of different voltages(e.g., GND line 554 and VCC line 555); and other signal lines that areless sensitive to corruption through cross-talk, etc. (e.g., line 563)may be routed between two reference voltage lines of the same voltage(e.g., VCC lines 555 and 556). After all signal lines are routed, theremay be tracks that are not used for routing signal lines. For example,tracks 565, 567 and 569 in FIG. 12 are not used for signal lines, whichcan be combined with the adjacent reference voltage lines tosubstantially widen (e.g., double the width) the corresponding referencevoltage lines and to reduce their impedances. This combining of linescan be done automatically by computer aided design systems (e.g. systemswhich use IC routing software to design ICs). For example, track 569shown in FIG. 12 can be merged with GND line 554 to form wider GND line584 in FIG. 13; track 567 in FIG. 12 can be shared by VCC line 552 andGND line 553 to form wider VCC line 582 and wider GND line 583 toproduce the result shown in FIG. 13; and track 565 in FIG. 12 is used asVCC line after vias 587 and 589 are inserted to connect line 581 to theVCC lines in the lower layer. It is understood that the unused trackscan also be combined with reference voltage lines in other forms. Forexample, voltage lines 551, 581 and 582 can all be combined into onewider line; and lines 584 and 583 may be combined so that the segment ofsignal line 502 in the upper layer is shielded by a U-shaped GND wireformed by the wire combined from lines 583 and 584.

When a track (or a portion of the track, e.g., 567 in FIG. 12) betweentwo reference voltage lines of different voltages is not used forrouting signal lines, the track can be used to widen the referencevoltage lines (e.g., run a separate reference voltage line on the track,or combine the track with one of the reference voltage lines, or sharethe track by the reference voltage lines), as described above. Undersome design rules which have spacing requirements that depend on wirewidth, it is desirable to run a separate reference voltage wire (e.g.,VCC or GND) on the track. The separate reference voltage wire may be ofa minimum width. Utilizing the open track between lines of differentreference voltages (e.g., VCC and GND) for widening reference voltagelines has the advantage of introducing decoupling capacitance betweenthe reference voltage lines. This approach is particularly useful, when0.13 micron (and below) technology is used. The traditional way ofadding decoupling capacitance is to fill available space with largetransistors whose gates are used as capacitors. However, at 0.13 micronand below the leakage current across the gate becomes large, consumingtoo much power. Additionally, transistor based decoupling capacitance isresistive and is not good for suppressing high frequency noise. Thedecoupling capacitance introduced in the shielding grid is good forsuppressing high frequency noise. Further, when a track (e.g., a portionof track) between two reference voltage lines of the same voltage (e.g.,VCC) is not used for routing the signal lines, the track can be used fora line of the same voltage or a line of a different voltage. Forexample, track 565 between two VCC lines in FIG. 12 can be used for VCCor GND. When the track is used for a reference line of a differentvoltage (e.g., GND), additional decoupling capacitance is added; whenthe track is used for a reference line of the same voltage (e.g., VCC),the track can be combined with neighboring references lines (e.g., VCClines 551 and 552) to further reduce the resistance of the combinedreference line. This decoupling capacitance aspect is described furtherin conjunction with FIGS. 28A, 28B, 29A, 29B and 30.

FIG. 28A shows an example of a one layer shielding mesh which includes arepeating pattern of at least two adjacent first reference voltage lines(e.g. VDD) and at least two adjacent second reference voltage lines(e.g. VSS). The shielding mesh 1200 shown in FIG. 28A includes four VDDlines (1201A, 1201B, 1201C, and 1201D) and four VSS lines (1202A, 1202B,1202C, and 1202D). The repeating pattern of two VDD and two VSS and twoVDD . . . provides certain advantages which are described below. Theshielding mesh 1200 may vary in size depending on the uses of the mesh.The density of the mesh may be very high such that the four lines 1201C,1201D, 1202C and 1202D may be within a distance D (1203) which is lessthan 2 microns or smaller. In those instances when the shielding mesh1200 is used to provide decoupling (e.g. bypass) capacitance, it isusually desirable to use a high density shielding mesh in order toobtain a desired level of decoupling capacitance between adjacentreference voltage lines. In other instances, the shielding mesh may havea lower density (e.g. D may be less than 20 microns or in some casesless than 50 microns). In the case of the shielding mesh 1200, it isused to shield at least one signal line 1204 and to provide at least onedecoupling capacitance through an added reference voltage line 1207.This use of shielding mesh 1200 is shown in FIG. 28B. As shown in FIG.28B, a signal line 1204 has been added to the shielding mesh between VDDreference voltage line 1201B and VSS reference voltage line 1202A. Thissignal line 1204 is shielded between these two reference voltage linesalong its entire length on the layer containing the shielding mesh. Itmay or may not be shielded in the layers above or below. The signal line1204 is coupled to lines (e.g. lines 1205C and 1205D) on other layersthrough connection vias 1205A and 1205B respectively. An additionalreference voltage line 1207 has been added between VDD reference voltagelines 1201C and 1201D to provide a bypass or decoupling capacitancebetween VDD and VSS within the IC on the layer containing this shieldingmesh. This additional reference voltage line 1207 provides about twiceas much decoupling capacitance as compared to an additional VSS linebetween a VSS line and a VDD line (e.g. an additional VSS referencevoltage line between VSS line 1202B and VDD line 1201C would provideonly about one-half as much decoupling capacitance as the additional VSSline 1207 as shown in FIG. 28B). The repeating pattern of 2 VDD linesand 2 VSS lines provides this additional capacitance because anadditional reference voltage line of a first polarity, which is designedto add decoupling capacitance, may be inserted between a pair of chargedreference voltage lines of a second polarity. The additional referencevoltage line 1207 may be coupled to another VSS line through theconnection via 1208 (or through another via, not shown, somewhere alongthe length of line 1207). It will be understood that additionalreference voltage lines may be added to increase the amount ofdecoupling capacitance provided by the shielding mesh, up to a desiredamount of decoupling capacitance to be provided by the shielding mesh.Thus, for example, if more decoupling capacitance is desired even afterline 1207 has been added, an additional reference voltage line may beadded (e.g. an additional VDD line may be added between VSS lines 1202Aand 1202B and an additional VSS line may be added between VDD lines1201A and 1201B). The shielding mesh 1200 may be used exclusively forproviding decoupling capacitance if no signal lines need to be shieldedin a particular design.

FIGS. 29A and 29B show another example of a shielding mesh whichincludes shielding for signal lines and decoupling capacitance. Theshielding mesh 1220 includes in a single layer of an IC a firstplurality of lines 1226A, 1226B, 1226C, and 1226D which are designed toprovide a first reference voltage (VSS in this case) and a secondplurality of lines 1227A, 1227B, and 1227C which are designed to providea second reference voltage (VDD in this case). The shielding mesh mayhave a high density which is useful when the mesh is also used toprovide decoupling capacitance. The density may be defined by the numberof lines (or portions of lines) within an area or the number of parallellines intersecting a linear distance, such as the distance L (1225) inFIG. 29A. The distance L may have the same range as D (in FIG. 28A) overa variety of different designs. FIG. 29B shows the shielding mesh 1220after two signal lines, 1230A and 1230B, and two additional referencevoltage lines, 1231 and 1232, have been added to the shielding mesh as aresult of a computer aided design process. Each of the signal lines1230A and 1230B have been shielded between an adjacent pair of oppositereference voltage lines. For example, signal line 1230A is shieldedbetween VSS line 1226A and VDD line 1227A. Connection vias 1229A and1229B respectively provide electrical contact to an adjacent layer forsignal lines 1230A and 1230B. The shielding mesh of FIG. 29B alsoincludes two additional reference voltage lines 1231 and 1232 which arerespectively coupled to an adjacent layer through connection vias 1231Aand 1232B. The additional VSS reference voltage line 1231, inconjunction with VDD line 1227B, provides a decoupling capacitor. Theadditional VSS reference voltage line 1232 and the VDD line 1227Cprovide another decoupling capacitor. It will be appreciated that theremaining slots (between the original reference voltage lines of themesh) may be used to add further additional reference voltage lines toincrease the decoupling capacitance provided by the shielding mesh.

FIG. 30 shows another example of a shielding mesh. This shielding meshis the same as the mesh of FIG. 12 except that a ground (GND) referencevoltage line 565A has been added and a VCC reference voltage line 569Ahas been added to provide decoupling capacitance. The VCC line 569A iselectrically coupled, through a connection via 569B, to another VCCline. The ground reference line 565A is electrically coupled, through aconnection via 565B to another GND line.

Some embodiments of the present invention use a mesh of wires both todistribute power and to shield signals. In a typical IC, the wires fordistributing power take a significant portion of routing resource. Whenthe shielding wires are also used for distributing power, the area costfor shielding can be reduced significantly.

FIG. 14 shows a detailed example of a two-layer shielding meshesconnected with a power grid according to one embodiment of the presentinvention. The power grid has wider lines 601-605 and 607-609 to deliverpower and ground to the IC circuit; and, the shielding meshes (e.g., amesh formed by lines 621-625 and lines 641-644) has narrower referencevoltage lines to shield signal lines (not shown in FIG. 14) routed inbetween the narrower reference voltage lines. The shielding lines (e.g.,641, 643, 621 and 625) tap into the power grid (e.g., through vias 651,652, 653 and 654) to provide shielding and power; and other vias in theshielding mesh (e.g., vias 655 and 656) couple the lines in the mesh toone of the two reference voltages (e.g. VCC or ground). Due to therelatively small segment lengths between certain vias (e.g. vias 655 and656), the shielding mesh functions to reduce the effective RC componentof the lines being connected to, which in turn reduces the noise andcoupling effect. The shielding mesh can be deployed on any substratearea where routing resources are used. The ratio in width between thepower grid lines (e.g., line 605) and the shielding mesh lines can be afactor from 2 to 10, or more. In one embodiment of the presentinvention, a typical shielding wire is of the size (width and/orthickness) of a typical signal line.

In FIG. 14, it is seen that different regions may use different types ofshielding meshes. For example, shielding wires 631-635 shield each ofthe tracks between an adjacent pair of the wires with different voltages(in other words a track for a signal wire between lines 631 and 632 is atrack that shields the signal wire between two different referencevoltages, VCC and GND); however, shielding wires 621-625 shield sometracks (e.g., between lines 621 and 622) between two of the wires withthe same reference voltage.

A shielding mesh can be used in the routing channel between blocks on asubstrate and also within a block of a substrate. Due to relativelysmall segment lengths of the shielding mesh, the shielding mesh reducesthe effective RC component of the routing line and the noise andcoupling effects caused by cross talk between signal lines.

In some congested regions, such as region 611 in FIG. 14, a window inthe shielding mesh can be used to make room for routing signal lines inthe window. In such windows, the signal lines are not shielded (or maybe shielded at a lower shielding density than the shielding densityoutside of the window); and conventional methods can be used in thewindow to route signal lines to avoid signal integrity problems.Typically, the window in a layer of shielding mesh is used to routelines from other layers.

The shielding mesh near local congestion areas can be replaced with awindow surrounded by a power ring. The area within the power ring, thewindow in the shielding mesh, may be completely unshielded and is takeninto account for any wire routed through the window. The number ofavailable tracks within the window is increased up to double the numberof tracks available for routing signals. A sparser set of shieldingwires, (e.g. a lower shielding density) such as those illustrated inFIGS. 7 and 8, can be used in the window. The creation of such windowsin layers of shielding mesh can be done automatically by computer aideddesign systems, such as systems which use IC placement and routingsoftware to design ICs.

For each wire routed through or in the window of the shielding mesh, itcan be determined whether or not the coupling between adjacent signallines may causes signal integrity problems. For example, an RLC modelcan be used to determine if the signal can be corrupted by coupling fromother signal lines (or power/ground current, if the shielding lines areconnected to the power/ground grid).

The congestion level (e.g. for routing signal lines) can be estimated bycomputer aided design systems in an early stage of routing or determinedafter an actual routing operation, which may be successful or not. Upondetermining that the level of congestion has become unacceptable (e.g.the wiring density exceeds predetermined design rules), the computeraided design system can then introduce (“open”) a representation of awindow in a shielding mesh in order to route wires within the window.The computer aided design system can then route signal wires within thewindow in order to reduce the level of congestion.

FIG. 15 shows a perspective view of a two-layer shielding mesh with awindow on each layer of shielding mesh for unshielded signal linesaccording to one embodiment of the present invention. Cells (e.g., gates711 and 713) on layer 701 on a substrate are connected through signalwires (e.g., lines 753 and 733). Within windows 751 and 731, signallines are not shielded by shielding wires. Without shielding wires inwindows 751 and 731, more resources (e.g. physical space on at least onelayer of the IC) are available to route the signal lines. Outsidewindows 751 and 731, shielding wires (e.g., lines 741, 742, 743, 745,746, 747) are used to provide shielding to the signal lines running inthe tracks between the shielding lines. Around the windows, wide powerlines (e.g., lines 721 and 723 connected through via 722 for VCC andlines 727 and 725 connected through via 726 for GND) are used to providepower to the region in the window and to reduce the impedance caused bythe window in the mesh.

Although FIG. 15 illustrates two windows of the same size in a two-layershielding mesh, the sizes of the windows in the two layers can bedifferent. Further, a single layer of shielding mesh (without a secondlayer) may use a window. FIGS. 16-18 shows in top views detailedexamples of two-layer shielding meshes with windows for unshieldedsignal lines according to embodiments of the present invention.

In the example of FIG. 16, a window is formed in a power grid betweenlines 801, 802, 803 and 804. Both the upper layer and the lower layerhave the same window size. Tracks 811-814 in the lower layer and tracks821-826 on the upper layer are all used to route signals from otherlayers, such as layers above tracks 821-826 and layers below the lowerlayer. In the example of FIG. 17, the window is only in the upper layer,where tracks 851-859 are used for routing signal lines to/from, forexample, layers above tracks 851-859; and, the shielding mesh of lines841-844 in the lower layer has no window between power grid lines 831,832, 833 and 834. In the example of FIG. 18, a power ring of wide wires861, 862, 863, and 864 are formed by combining adjacent referencevoltage lines and the tracks in between so that the wires for the powerring are substantially wider (e.g., more than 2 to 5 times the width ofan typical signal line). The power ring provides current flows aroundthe windows to reduce (or compensate) the impedance in the shieldingmesh caused by the window. VCC line 873 is connected to line 862 of thepower ring through via 872. VCC line 873 is not connected to GND line871; and GND line 871 taps into line 861 of the power ring through via874. GND line 882 is connected to line 861 of the power ring; however,VCC line 881 is not connected to line 861 of the power ring. Instead,via 883 connects VCC line 881 to VCC line 885, which taps into the powerring through vias 886 and 887. Thus, different types of shielding meshesoutside the power ring are formed by selectively placing the vias forconnecting the shielding wires in different layers, selectivelyconnecting or disconnecting shielding wires at certain locations, andselectively combining tracks.

From this description, it can be seen that a window in the shielding canbe on a single metal layer (e.g., the layer of the horizontal lines inFIG. 17) or at the same location on two neighboring metal layers (e.g.,the layers of the horizontal lines and vertical lines in FIG. 16).Further, it is understood that the windows on neighboring metal layersmay not be at the same location and may not be of the same size. Thewindows on neighboring metal layers can have different sizes andpartially overlapping with each other. It is desirable, but not alwaysrequired, to constrain the size of the window such that the maximumlength of a signal line in the window is less than an allowableunshielded length of the signal line. In this way, any unshielded signallines in the window are not impacted enough by neighbors in the window.If a window is sized in this way, signal lines may be routed in thewindow without worrying about (or calculating parameters relating to)signal integrity (at least for the portion of the signal line in thewindow).

Although various examples of the present invention are illustrated usingthe routing architecture where the lines in the two neighboring layersare routed in a rectilinear way (e.g. the lines in one layer are at anangle of 90 degrees relative to the lines in the other (e.g. next)layer), it is understood that various embodiments of the presentinvention can also be used for different routing architectures. Forexample, the lines of two neighboring layers can be in an angle of, forexample, 45 degrees so that the lines in one of the layers are routed ina diagonal direction. For example, in an X architecture (e.g., developedby Simplex, now Cadence) wires in a set of metal layers of a chip arerouted in a direction that is 45 degrees from the standard architecture.It is understood that various embodiments of the present invention canbe used with different angles of routing directions, regardless of therelative orientation between layers. For example, the wires in the firstfew (shielded) layers are routed in horizontal/vertical directions; andthen, the wires in a shielded pair of layers are routed in diagonaldirections (e.g., 45 degrees from the horizontal/vertical directions).

FIG. 32 shows an example of a routing architecture of an IC in which atleast a first layer and a second layer have conductive lines (e.g. lines1277A, 1277B, and 1277C) which are routed substantially orthogonallyrelative to a first reference axis and a second reference axis and inwhich at least two additional layers comprise a shielding mesh whichincludes conductive lines (e.g. lines 1279A, 1279B, 1281A, and 1281B)routed substantially non-orthogonally relative to the first and secondreference axes. In the example of FIG. 32, lines 1277A, 1277B and 1277Cmay be lower metal layers (e.g. second and third metal layers in an IC)and lines 1279A and 1279B may be in the fourth metal layer of the IC andlines 1281A and 1281B may be in the fifth metal layer of the IC. It willbe appreciated that FIG. 32 is a top view of a portion of an IC which istransparently rendered (such that lower metal layers can be seen). Itcan be seen from FIG. 32 that lines 1277A, 1277B, and 1277C are routedsubstantially orthogonally relative to first and second reference axeswhich may be the edge of the IC. Lines 1279A and 1279B are routed at anon-orthogonal angle (e.g. about 45°) relative to these two referenceaxes, and lines 1281A and 1281B are also routed at a non-orthogonalangle relative to these two reference axes. While the non-orthogonalangle may be about 45°, it will be appreciated that other angles may beused.

FIG. 19 shows an example of signal lines routed in the presence of an IP(Intellectual Property) block without a shielding mesh. An IP block is ablock of pre-designed circuitry, typically purchased or licensed from avendor. This pre-designed block is normally completely designed and laidout and completely routed (e.g. the internal routing of signals withinthe block are done and cannot be re-routed). There is typically a firstdesigner which has designed the IP block which will then be used as abuilding block for a larger design which includes the predesigned block.For example, the design of the circuitry for scanning a keyboard (e.g.,an Intel 8051 microcontroller like block) can be purchased andincorporated as a “black box” in an IC on a substrate. Other examples ofsuch predesigned blocks include memory blocks from Virage Logic or logiccores (blocks) from ARM. Certain aspects of an IP block are typicallyunknown to the designer of the IC which is to incorporate the IP blockso that any interference to the circuitry of the IP block would beavoided to preserve signal integrity. For example, blocks 905 and 901are connected to IP block 903 through wires 913, 915 and 917. Signalline 911 connects blocks 905 and 901. Since certain aspects of the IPblock are not known when designing the IC chip, it cannot be easilydetermined whether or not a signal wire that does not belong to the IPblock can cause signal integrity problems when the signal wire is routedthrough or over the IP block. If the wire is routed through or over theIP block, capacitive and inductive coupling between the wire and thewires of the IP block (e.g., signal line 907) may cause signal integrityproblems. Thus, a conventional method typically routes the wire (e.g.,line 911) around the IP block, as shown in FIG. 19, rather than over theIP block. It can be seen from FIG. 19 that the IP block includes atleast one routing layer for routing signals within the IP block and alsofor connecting the IP block to blocks (e.g. logic) outside of the IPblock.

According to embodiments of the present invention, long routes for IPblocks can be routed in a shielding mesh through/over the IP block in,for example, a shielding layer that is an integral part of (and designedas part of the) predesigned block; and channels in the shielding meshcan be used for signal lines that do not belong to the IP blocks (e.g.signals that are not directly connected to the IP block or are notoriginating from the IP block), because there is no danger of couplingwhen the signal lines are shielded in the mesh within the IP block.Alternatively, a virtual route can be performed, where each route has abound on a function of resistance and capacitance along the routethrough the shielding grid; and these routes are then completed as partof the chip top level routing. This provides more flexibility for toplevel routing. A successful independent route of the IP block can beused as a starting point to guarantee success in routing for the IPblock.

FIGS. 20-21 shows examples of signal lines routed through a region foran IP block in a shielding mesh according to embodiments of the presentinvention. In the top view of the IC in FIG. 20, shielding mesh 930,which is designed as an integral part of the predesigned IP block, isused to shield the wires (e.g., line 907 which originates in block 903and ends in block 903) of IP block 903. When the design of block 903 iscompleted and ready to use in a larger design, the block 903 includes acompletely laid out routing architecture except for an integralshielding layer (or layers) which is used to route lines originating inthe block 903 or ending in the block 903 as well as lines which are notpart of the block 903, such as signal lines which originate from anotherblock and which are not directly connected to circuitry in block 903.Thus, while nearly all of the design of block 903 is completed andgenerally not revisable in the process of incorporating the block 903into a larger design, an integral shielding layer in block 903 iscapable of being changed. Reference voltage wires (e.g., lines 935, 937and 939) are added into the routing area (a shielding mesh 930) of theIP block to shield signal lines. Signal line 931 for connecting blocks905 and 901 is routed in shielding mesh 930 which is a two layershielding mesh. Since signal line 931 is shielded from the signal lines(e.g., line 907) of the IP block, signal line 931 can be routed throughthe region for the IP block without signal integrity problems. AlthoughFIG. 20 shows only an example where a signal line from outside an IPblock is routed through the region of the IP block in a shielding mesh,it is apparent from this description to one skilled in the art that ashielding mesh can be used in many different ways to shield the signallines that do not belong to the IP block from the wires of the IP block.For example, the shielding mesh can be in layers above the layers forrouting the wires of the IP block; and a signal line for other blocks isrouted in the shielding mesh above the IP block (e.g., a shielding linethat runs in parallel with the signal line in a layer below the signalline can be used to shield the signal line from the signal lines belowthe shielding line; more details about inter-layer shielding areillustrated in FIG. 5). Further, wires of the IP block can be re-routedin the shielding mesh. FIG. 21 shows such an example, where wire 947 ofIP block 903 is re-routed. The resistances (and/or capacitances) of there-routed wires may be determined to prevent significant changes in theproperties of the re-routed wires.

In addition to running signals at risk in the shielding grid, one canalso limit the maximum unshielded run of high edge rate signals. Inorder to know the maximum unshielded length of a signal, one can createan RLC (Resistance, Inductance and Capacitance) model of the driver,wire, neighbor wires and associated coupling. The neighbors are known asaggressors and the signal being routed is known as the victim. The worstcase edge rate (or current ramp for inductance) is inputted into themodel to see of it causes a signal integrity problem. The maximumunshielded length for the signal being routed (victim) can then bereduced so that the signal integrity is preserved. One way to increasethe maximum unshielded length is to limit the edge rate (or the di/dtfor inductance) of the aggressors, by requiring them to be shielded.Clock nets, for example, have both high currents and edge rates andshould therefore run shielded for most of their length. Other highfanout signals could have high currents even if they have moderate edgerates.

In order to achieve a complete route, it may be necessary to leave anumber of signals somewhat over the risk threshold. In these cases,signal integrity can be achieved by existing techniques such asbuffering/sizing the driver, picking alternate neighbor signals that donot transition at the same time as the potential victim, spacing thewire farther from other wires, widening the wire for part of its lengthto lower resistance, or dropping in a shield wire which can be easilyconnected to the shielding grid above or below. This will be much easierbecause the risk level has been dramatically reduced by partial use ofshielding on the victims.

FIG. 22 shows a flow diagram of designing an integrated circuitaccording to one embodiment of the present invention. The process canbegin with the creation of a description of the desired circuit in aHardware Description Language (HDL) which is known in the art. Thisdescription can then be compiled to yield another description such as aRegister Transfer Level (RTL) description which can then be furtherprocessed in a logic synthesis process. Operation 1001 performs logicsynthesis to create a logic element network that performs a given set offunctions. The logic synthesis operation may transform and restructurethe logic to optimize delays, areas and other design goals. Thegate-level logic elements are mapped to vendor specific primitives whichare placed in blocks on the chip. Operation 1003 places the vendorspecific primitives on the chip and routes the wires between theprimitives. At least a portion of the wires are routed in a shieldingmesh, which is energized by at least two different voltages. Operation1005 performs analysis and optimization to meet various designrequirements, such as timing requirements, and to optimize performance.In place optimizations are typically performed to optimize timing bychanging the physical characteristics (e.g., size) of the logic elementswithout changing the placement of the logic elements. In placeoptimizations typically tweak transistor sizes without moving the logicelements around. A timing analysis is typically performed based on thedetailed placement and routing information to determine whether or notthe timing requirements are satisfied. Some (or all) of operations1001-1005 may be repeated in iterations to satisfy the designrequirement and to optimize the design. The design process of FIG. 22may be used with any of the various methods and processes describedherein to produce an IC which includes a shielding mesh, and this designprocess may be performed with a computer aided design system whichstores and manipulates digital representations (e.g. HDL listings,unplaced netlists, placed netlists, etc.) in the system. Therepresentation includes information about the shielding mesh and routingof wires through the shielding mesh.

FIG. 23 shows a method to route signal lines for an integrated circuitaccording to one embodiment of the present invention. Operation 1011determines a mesh of reference voltage wires for at least two referencevoltages (e.g., VCC and GND) for an area (e.g., according to thecongestion level of the area) where there is at least one track betweentwo adjacent reference voltage wires in the mesh for routing a signalline. In one embodiment of the present invention, the reference voltagewires are interconnected (e.g., through connection vias) for each of thereference voltages to form a reference voltage mesh so that the segmentsbetween the connections are reduced. According to the congestion level,which may be estimated before a routing operation or determined from aprevious routing operation, the pattern of the reference voltage wiresand tracks (e.g., patterns as shown in FIGS. 6-10) for routing signalsis determined (or selected). For example, the shielding mesh may have awindow with a ring (e.g., FIGS. 15-18) surrounding the window for a verycongested area such as a congested area in a layer above or below thewindow; or a shielding mesh in one layer may have a pattern as shown inFIG. 10 for a less congested area or a shielding mesh in one layer mayhave a pattern as shown in FIG. 28A. Operation 1013 routes signal linesin the area using the tracks between the reference voltage wires in themesh. If operation 1015 determines that there are not enough tracks forrouting the signal lines, operation 1021 routes some wires to otherlayers or changes mesh structure (wire patterns) for this congestedarea; otherwise, operation 1017 determines whether or not there aretracks unused for routing signal lines. If there are unused tracks(entirely unused tracks, such as track 565 in FIG. 12, or partiallyunused tracks, such as track 567 in FIG. 12), operation 1019 determineswhether or not it is desirable to use a different mesh. If it isdesirable to use a different mesh, the mesh structure can be changed inoperation 1023 to assign more areas for the shielding wires to improvethe effectiveness of shielding and the capacity of the mesh todistribute current with minimum voltage drops; otherwise, operation 1025combines the unused tracks with adjacent reference voltage wires towiden the corresponding reference voltage wires (generate widershielding wires with larger current carrying capacities). Someoperations in the example of FIG. 23 are optional; and different flowsequences may be used. For example, operations 1019 and 1023 are notperformed in one embodiment of the present invention.

FIG. 24 shows a method to route signal lines in a shielding meshaccording to one embodiment of the present invention. After operation1031 routes each of the signal lines that are critical for signalintegrity between wires of different reference voltages in a shieldingmesh, operation 1033 routes the remaining signal lines between wires ofthe shielding mesh. For example, noisy signal lines (e.g., with a strongdrive strength) and long signal wires, which can be critical for signalintegrity, are better shielded between shielding wires of differentvoltages (e.g., between GND and VCC); and short signal wires can berouted between shielding wires of a same voltage (e.g., between aGND/GND pair or a VCC/VCC pair). Operation 1035 combines adjacent wiresof a same reference voltage in the shielding mesh with one or moretracks that are not used for routing signal lines into a single, largerwire for the reference voltage. Various methods to combines the adjacentwires, as illustrated in FIG. 13 and described above (e.g., splitting atrack for widening adjacent shielding lines of different voltages,filling in the area between adjacent shielding lines of a same voltage,or combining a track with one adjacent shielding line, and others), canbe used to widen shielding lines.

FIG. 25 shows a method to route signal lines in a shielding mesh with awindow for unshielded lines according to one embodiment of the presentinvention. This method may begin as a result of analysis, by a computeraided design system, of the level of congestion of wires and routes in arepresentation of the IC being designed. This may occur in an earlystage of a routing process by the computer aided design system (e.g. asan estimation of congestion in the design, such as an estimation ofspace available for routing signal and other lines within the available,desired space of the IC under design or the level of congestion in thedesign may be determined after an actual routing operation. In thismethod, at least a portion of at least one layer of the representationof the IC includes a shielding mesh which has been introduced into therepresentation of the design stored by and manipulated by the computeraided design system. The analysis of the level of congestion takes intoaccount the presence of the shielding mesh, which reduces the areaavailable for routing of lines, such as signal lines, on the IC beingdesigned. The analysis produces a determination of the level ofcongestion in the representation of the IC. Upon determining that thelevel of congestion has become unacceptable (e.g. the wiring density istoo high to perform a successful routing of the lines on the IC giventhe desired size, in area, of the IC or the wiring density exceeds apredetermined design rule such as the minimum width of a line), then thecomputer aided design system introduces a window in the shielding meshwhere the window has at least a lower density of shielding than thedensity of shielding in the shielding mesh which at least in partsurrounds or abuts the window. The size of the window may be limited inorder to assure that there is only a small length of signal lines whichare unshielded in the window. It is possible to tolerate minimalcoupling between smaller lengths of unshielded signal lines (rather thanlonger lengths of unshielded signal lines which will tend to couplesignals more due to the longer length of the unshielded signal lines).Thus, the size of the window may be designed to limit its size which inturn will limit the size (e.g. length) of any unshielded signal lines inthe window.

Operation 1041, performed by a computer aided design system, generates amesh of reference voltage wires for at least two reference voltages(e.g., VCC and GND) with a window in the mesh. This may occur as aresult of a computer aided design system creating a representation of awindow in a representation of the shielding mesh. In one embodiment ofthe present invention, the window is surrounded by wider shielding wiresto reduce the impedance in the shielding mesh caused by the window; inanother embodiment of the present invention, a sparser set of shieldingwires of different voltages are used in the window. Operation 1043routes first signal wires in the mesh where each of the first signalwires is adjacent to at least one reference voltage wires within alayer; and operation 1045 routes second signal wires in the window whereeach of the second signal wires is between two other signal wires withina layer. Some of the second signal wires may be entirely in the window;and some of the second signal wires may be partially the window andpartially shielded in the mesh. Signal integrity analysis may beperformed for the second signal wires to determine if signal integrityin the IC is preserved.

FIG. 26 shows a method to route unshielded or partially shielded signallines in a window of a shielding mesh according to one embodiment of thepresent invention. Operation 1051 determines the maximum (allowable)unshielded length of a signal wire that can be unshielded by a mesh ofreference voltage wires. In one embodiment of the present invention, anRLC (Resistance, Inductance and Capacitance) model of the driver, wire,and neighbor wires are used to determine the signal coupling. Theneighbors are known as aggressors, and the signal line being routed isknown as the victim. The RLC model assumes that a worst case aggressoris along an unshielded portion of the “victim.” The RLC model is used toanalyze the effect of the worst case edge rate (or current ramp forinductance) in order to determine the maximum unshielded length of thesignal wire in assessing signal integrity. Operation 1053 determineswhether or not the signal wire can be routed with an unshielded lengthless than the maximum unshielded length. If the signal cannot be routedwith an routed with an unshielded length less than the maximumunshielded length and operation 1055 determines that the shielded lengthof the aggressor of the signal wire cannot be increased, operation 1057applies conventional methods (e.g., inserting a buffer/repeater, sizingthe driver, picking alternative neighbor signal lines that do not havetransitions at the same time as the signal wire, increasing the spacingbetween the signal wire and the aggressor, widening the signal wire,adding a shield wire, or others) to achieve signal integrity for thesignal wire. Otherwise, operation 1059 shields the aggressor in a meshof reference voltage wires (e.g., reducing the portion of the aggressorthat is not shielded in the shielding mesh).

Some embodiments of the present invention allow external signals to berouted through or over a region for an IP block (e.g. a predesignedblock, such as block 903) without the fear of signal integrity problemscaused by unknown signals being routed near the internal signals of theIP block.

FIG. 27 shows a method to route signal lines through a region of apre-designed block of circuit (such as an IP block) in a shielding meshaccording to one embodiment of the present invention. Operation 1061shields at least a portion of the wires of a pre-designed block (e.g.,an IP block) of circuitry in a mesh of reference voltage wires.Operation 1063 routes a signal wire that is not a part of thepre-designed block of circuit through the mesh, which shields the signalwire from the wires of the pre-designed block. If operation 1065determines that it is desirable to re-route a portion of the signallines of the pre-designed block of circuit, operation 1067 routes theportion of the signal lines in the shielding mesh. Thus, after ashielding mesh is added to the routing area for the IP block (in a topview of the IC), signal wires for other block can be routed through orover the region defined by the IP block; and some of the wires of the IPblock can be re-routed.

FIG. 31 shows a flowchart which depicts a method 1250 of designing an ICwhich includes a shielding mesh with decoupling capacitance. This methodmay be used in designing shielding meshes as shown in FIG. 28B or 29B.The method 1250 includes operation 1251 in which a target (or desired)amount of decoupling capacitance is determined. In operation 1253, anestimate is made of the amount of available routing resources. Inoperation 1255, a portion of the available routing resources is deductedin order to preserve tracks in the shielding mesh for the addition ofadditional reference voltage lines (which act as decoupling capacitancelines) in the shielding mesh. A representation (e.g. a computer aideddesign representation) of the shielding mesh is created in operation1257, and in operation 1259, representations of signal lines are routedin the shielding mesh. If gaps (e.g. the gap between lines 1201C and1201D) in the shielding mesh are available after the signal lines havebeen routed, then additional reference voltage lines may be added inoperation 1261 to increase the amount of decoupling capacitance, up tothe amount of desired decoupling capacitance.

FIG. 33 shows an example of a shielding mesh which includes severaldifferent types of shielding in the mesh. FIG. 33 is a top view of aportion of an IC and shows two routing layers of the IC and also showscertain logic (logic A, B and C) which is on lower layers of the IC. Theshielding mesh 1301 includes four double layer shielding meshes 1310,1312, 1314, and 1316 and at least eight single layer shielding meshes1302, 1303, 1304, 1305, 1306, 1307, 1308, and 1309. There are alsounshielded regions which do not include any shielding wires, and thusany signal lines in these regions are unshielded. The unshielded regionsinclude a region which contains logic A (1370), a region which containslogic B (1371) and which is bounded by single layer shielding meshes1302, 1304, 1306 and 1308, and a region which contains logic C (1372).There are also unshielded regions to the left of a widened VDD line 1324and to the right of a widened VSS line 1327 as shown in FIG. 33. Eachshielding mesh contains a first plurality of lines (e.g. lines 1321,1323, 1324, 1326, 1336, 1338, 1331, 1333, 1341, 1343, 1345 and 1347)which are designed to provide a first reference voltage (e.g. VDD) and asecond plurality of lines (e.g. lines 1320, 1322, 1325, 1327, 1330,1332, 1335, 1337, 1340, 1342, 1344, and 1346) which are designed toprovide a second reference voltage (e.g. VSS in the case of FIG. 33).The larger reference voltage lines (e.g. lines 1320, 1321, 1322, 1323,1324, 1325, 1326, and 1327) provide increased current carry capacity forthe shielding and provide interconnections (e.g. through connection vias1350, 1351, and 1352) to other reference voltage lines in the shieldingmesh. The connection vias between layers are shown by an “X” in FIG. 33;FIG. 4 shows, in perspective view, examples of connection vias in adouble layer shielding mesh (see connection vias 301 and 303 in FIG. 4).Additional connection vias may be added to further improve the quality(e.g. reduced impedance) of the shielding mesh. The connection vias arealso used to route signal lines from one layer to another layer above orbelow the one layer; for example, connection vias 1353, 1354, 1355 and1356 provide for the routing of signal lines from logic A (1370) tologic B (1371) and logic C (1372) as shown in FIG. 33. It will beappreciated that a single layer shielding mesh in the architecture ofFIG. 33 will resemble the shielding mesh of FIG. 29; however, a doublerepeating pattern shielding mesh (e.g. as shown in FIG. 28) mayalternatively be used in either or both of the single layer and doublelayer shielding meshes of FIG. 33. It will also be appreciated thatadditional reference voltage lines may be added to the shielding mesh toprovide bypass capacitance between the reference voltages (e.g. see FIG.28B; the adding of these additional reference voltages would normally beperformed after successfully routing all signal lines in a manner whichsatisfies timing constraints of the IC. The double layer shielding mesh1312 is slightly larger than the other double layer shielding meshes1310, 1314 and 1316 and provides additional double layer shielding meshcapacity; the other double layer shielding meshes may similarly beincreased in size. Similarly, one or more of the single layer shieldingmeshes may extend beyond the widened VSS and VDD lines.

The routing of signal lines in the shielding mesh 1301 will now bedescribed relative to signal lines coupling logic A, logic B and logic Cin FIG. 33. It will be appreciated that additional logic units withadditional signal lines may also be routed in the shielding mesh of FIG.33. Logic A (1370), in an unshielded region below the single layershielding mesh 1308, provides two signal lines 1373 and 1374 which mayboth be outputs driven by a driver in logic A (1370). A first unshieldedportion of signal line 1373 extends from logic A and is routed to anarea below the single layer shielding mesh 1308. A connection via 1353electrically connects signal line 1373 from one layer (e.g. a firstlayer) to another layer (e.g. a second layer) which includes the singlelayer shielding mesh 1308, from which point the signal line 1373 isrouted in the single layer shielding mesh 1308 and into the double layershielding mesh 1316 where the signal line 1373 is electricallyconnected, through connection via 1355, to a routing of signal line1373, on the first layer, and this routing of signal line 1373 extendsalong an available gap or track in the single layer shielding mesh 1306until it reaches the connection via 1356. At connection via 1356, thesignal line 1373 is routed to the second layer and extends away frommesh 1306 in an unshielded region and connects to logic B to driveinputs in logic B. It can be seen from FIG. 33 that only a small portionof signal line 1373 is unshielded and this small portion may be within amaximum allowable unshielded length for signal line 1373. The unshieldedregions of FIG. 33 may be considered “windows” (which are similar to thewindows described herein, such as the window shown in FIG. 15).

Signal line 1374 has a similar routing path as signal line 1373 exceptthat signal line 1374 passes through three single layer shielding meshesand two double layer shielding meshes on its way from logic A (1370) tologic B (1372). A first unshielded portion of signal line 1374 extendsfrom logic A and is routed to an area below the single layer shieldingmesh 1308. A connection via 1354 electrically connects signal line 1374from the first layer to the second layer which includes the single layershielding mesh 1308, from which point the signal line 1374 is routed inthe mesh 1308 and into the double layer shielding mesh 1316. In thismesh 1316 the signal line 1374 is electrically connected through aconnection via to a routing of signal line 1374, again on the firstlayer, through an available gap in the mesh 1306 until it reaches anelectrical connection via 1357 within the double layer shielding mesh1314 which connection via 1357 causes the signal line 1374 to be routedbetween lines 1336 and 1337, firstly in the double layer shielding mesh1314 and then in the single layer shielding mesh 1304 until line 1374reaches the connection via 1358. At connection via 1358, the signal line1374 is routed to the first layer (from the second layer which includeslines 1336 and 1337) and extends away from mesh 1304 into an unshieldedregion which includes connections to logic C, where signal line 1374connects to logic C to drive inputs in logic C (1372). It will beappreciated that the use of shielding meshes may allow higher powerdrivers (e.g. amplifiers) to be used to drive the signal lines which areshielded (e.g. lines 1373 and/or 1374).

It will also be appreciated that, as shown in FIG. 33, additional logicunits (e.g. logic D, labeled 1380) may be connected through unshieldedsignal lines 1381 and 1383 to logic B in the unshielded region whichcontains both logic B and logic D. It is possible, in the example shownin FIG. 33, to route signal lines 1381 and 1383 without shieldingbecause these lines are short enough (e.g. the maximum unshielded lengthcalculated from RLC models for signal lines 1381 and 1383 is less thanthe actual unshielded length of the routed signal lines 1381 and 1383shown in FIG. 33) that they do not require shielding. It will also beappreciated that a predesigned block (e.g. an IP block with or withoutits own integral shielding mesh) may be incorporated into an unshieldedregion.

An alternative of the shielding mesh 1301 may use a structure which issimilar to the shielding mesh 1301 but in which one or more portions ofthe mesh exist on other layers (other than the two layers whichcomprise, for example, the double layer shielding mesh 1310). Forinstance, one or more of the long primarily single layer meshes (e.g.mesh 1306 and 1308) and their shielded signal lines (e.g. 1373 and 1374)may be routed for a portion of their runs along the two layers havingdouble layer shielding meshes 1310 and 1316 and then be routed down orup, through connection vias, to other layers and then back to the twolayers having the double layer meshes 1310 and 1316. Thus, the singlelayer mesh runs between the crossover areas (the double layer meshareas) may change to other layers. In one particular embodiment thesesingle layer mesh runs with their shielded signal lines may be placed onpre-fabricated or pre-configured layers such as those found in gatearrays and structured ASICs where some mesh layers are held fixed acrossdifferent designs, which saves routing resources on the configurablelayers. In this case, the unused routing tracks between referencevoltages can be used to increase the current carrying capacity of thepower grid and to provide bypass capacitance for the grid. A subset ofthese routing tracks may also be pre-configured with repeaters toimprove performance and signal integrity of signals routed over verylong distances.

FIGS. 34A, 34B and 35 show another exemplary method for designing an IC.Operation 1450 of FIG. 35 may begin after a compilation of a technologyindependent HDL (hardware description language) into an RTL (registertransfer level) description which is converted into a technologydependent RTL netlist. Other techniques may be used to create the RTLnetlist. In operation 1450, physical synthesis is performed using an RTLcircuit description (e.g. an RTL netlist) and timing constraints and afloorplan (if any); this physical synthesis places the logic primitivesin the netlist and optionally generates a congestion estimate (e.g. anestimate of the amount of routing relative to the available routingresources). In operation 1452, a shielding mesh is planned. Theshielding mesh may include an optional hole or window for routing incongested areas. Then in operation 1454, signal lines are routed inshielded or unshielded layers or regions based upon exposure rules forsignal lines and based upon the use of preferred tracks in the mesh.These exposure rules include: (a) routing long signal lines betweenopposite reference voltage lines in a shielding mesh, if possible; (b)routing noisy signal lines (e.g. those having predictably high edgerates) between opposite reference voltage lines in a shielding mesh; (c)routing clock lines in the shielding mesh; (d) routing signal lines,which have a length which exceed their calculated maximum unshieldedline length, in a shielding mesh; (e) routing in a shielding mesh signallines which transition between signal states (e.g. high to low and viceversa) at near the same time as another adjacent signal line and (f)routing signal lines which are not directly connected to a predesignedblock (e.g. IP block) through an integral shielding layer in the block.Other exposure rules and preferred tracks are also described herein. Anexemplary result of operation 1454 is shown in FIG. 34A in which a twolayer shielding mesh 1401 includes a first plurality of referencevoltage lines 1402, 1406, 1410, 1414 and 1418 which provide a firstreference voltage (VSS in this example) and a second plurality ofreference voltage lines 1404, 1408, 1412, and 1416 which provide asecond reference voltage (VDD in this example). These reference voltagelines together form the two layer shielding mesh 1401. The operation1454 has successfully routed signal lines S1 (1420), S2 (1422), S3(1424), S4 (1426) and S5 (1428) through the shielding mesh 1401.Connection vias between layers are shown with an “X.” Signal line S6(1430) has not been successfully routed by the first performance ofoperation 1454, and this is shown in FIG. 34A as a lack of connectionbetween the upper and lower portions of signal line S6. This failure toroute a signal line is detected in operation 1456 of FIG. 35 and causesthe system to perform operation 1460. Operation 1456 also detectswhether a routing of a signal line has caused a timing critical signalto be too late (e.g. a detour of a critical path signal line has causedthe signal line to have a negative slack); if this is detected,operation 1460 is also performed. An exemplary result of operation 1460and a repeat of operation 1454 is shown in FIG. 34B as operation 1460has identified that a portion of shielding line 1404 is removable andthat shielding line has been removed and replaced with shielding lines1404A and 1404B which leave a gap to allow for routing of signal line S6(1430A) which is shown, in FIG. 34B, as routed through the trackpreviously reserved for line 1404. After operation 1456 determines thatrouting was successful, then in operation 1458, bypass capacitance linesmay be added in the open slots between reference voltage lines. Forexample, in the case of the shielding mesh 1401A, an additionalreference voltage line (e.g. VSS) may be added between reference voltagelines 1410 and 1412 and/or between lines 1416 and 1418. The amount ofadditional reference voltage lines which are added will depend upon thedesired or target amount of decoupling or bypass capacitance for theshielding mesh.

FIG. 36 shows another aspect of the inventions described herein. Anexemplary embodiment of this aspect is shown in the operations of FIG.36. In operation 1601, a temperature profile of an integrated circuit isdetermined, and from this temperature profile, it is determined that thetemperature profile of the integrated circuit is too uneven andtherefore requires a more even distribution of heat across theintegrated circuit. This operation may be performed through softwaresimulation of the integrated circuit or through actual physicaltemperature measurements of various points on the integrated circuit. Ifthe temperature profile is relatively flat across the surface of theintegrated circuit, this would indicate that the temperaturedistribution across the integrated circuit is relatively even. On theother hand, if the profile reveals peaks and valleys which representhigh and low points of temperature readings over the integrated circuit,then the temperature profile may be too uneven. In response todetermining that the temperature profile is too uneven, a designer mayinsert in operation 1603 a shielding mesh which typically includesalternating lines of first and second reference voltages. This shieldingmesh may be added to one or more layers of the integrated circuit whichis being designed. The insertion of the shielding mesh may be performedthrough a computer aided design program which inserts a representationof the shielding mesh into a representation of the integrated circuitwhich is then fabricated to include the shielding mesh into the actual,physical integrated circuit. The shielding mesh will help to even outthe distribution of temperatures on the integrated circuit.

FIG. 37 shows an alternative embodiment of the shielding mesh shown inFIG. 33. In this alternative embodiment, a portion of the shielding meshhas been eliminated as shown in FIG. 37. In this particular example, adouble layer shielding mesh has been removed which leaves severalsignals unshielded as they transition from one layer to the other layerthrough two connection vias. In particular, signal lines 1373 and 1374transition from one layer to another layer through connection vias 1622and 1624 in an unshielded region of the integrated circuit 1620 shown inFIG. 37. This may be acceptable when the length of the unshieldedportion of these lines is relatively short or this may be acceptablewhen the signal transition times of the two lines are relativelydifferent (e.g. the transition times of the two signals on these twosignal lines do not overlap or differ by more than a predeterminedperiod of time, such as 20 nanoseconds). It will be appreciated thatalternative examples may include the removal of other shielding portionsof the shielding mesh such as additional portions of the double layershielding mesh or additional portions of the single layer shieldingmesh.

FIG. 38 shows an integrated circuit 1650 which is another alternativeembodiment of the shielding mesh shown in FIG. 33. In the shielding meshshown in FIG. 38, there is an additional shielding mesh 1652 which hasbeen inserted into the central region (a previously unshielded region)of the shielding mesh. This shielding mesh 1652 includes a plurality oflines carrying reference voltages VDD and VSS, where these lines arearranged substantially diagonally (e.g. about 45°) relative to all ofthe other lines in the shielding mesh shown in FIG. 38. Signals may berouted through this shielding mesh 1652, such as signal 1656 from logicE designated as logic 1654, and this signal is then routed through aconnection via 1658 into the remainder of the shielding mesh as shown inFIG. 38.

FIG. 39 shows another example of a shielding mesh which includes twolayers of conductive lines providing alternating reference voltages. Inparticular, the shielding mesh 1680 includes lines 1685, 1686, 1687, and1688 in one layer, and also includes conductive lines 1681, 1682, 1683,1684, and 1695 in another layer, which may be an adjacent layer(adjacent to the layer containing lines 1685-1688). Two signal lines1690 and 1691 are shown routed through the shielding mesh formed bylines 1681-1684 and 1695. These signal lines are coupled to adjacentreference voltage lines which form the shielding mesh. In particular,signal line 1690 is coupled through an interconnection device 1693 tothe line 1681 which forms a portion of the shielding mesh in one layerof the shielding mesh 1680. Similarly, the signal line 1691 is coupledto an interconnection device 1694 to the reference voltage line 1682which is part of the shielding mesh. This particular embodiment allows asignal line to be selectively connected through an interconnectiondevice to one of the reference voltage lines in the shielding mesh. Theconnection may be selected through the use of an active device, such asan active field effect transistor, or may be selected through the use ofa fuse or anti-fuse. Thus, the interconnection device may be an activetransistor or a fuse which is programmable or an anti-fuse which isprogrammable. This allows a designer to use the shielding mesh or aportion of the shielding mesh for additional programmability whendesigning an integrated circuit.

FIG. 40 shows an alternative embodiment of a shielding mesh having awindow which is unshielded and having power rings to provide thereference voltages to the shielding mesh. The embodiment of FIG. 40 maybe considered an alternative embodiment of the shielding mesh shown inFIG. 15. The shielding mesh shown in FIG. 40 includes a first layer 1703and a second layer 1705, each of which includes a shielding mesh formedof the plurality of conductive lines carrying, in an alternating manner,two reference voltages (in this case, VCC and ground). In each of theselayers, there is a window in which the lines in the shielding mesh whichcarry the reference voltages are absent; this area may be referred to aswindows in each shielding mesh and provide for the routing of signallines in an unshielded manner. These windows are often created whenthere is congestion in routing signals through the shielding mesh. Twoother layers 1702 and 1704 are also shown in this representation (in aperspective view) of the various layers of an integrated circuit. Layers1704 and 1702 include power rings or power lines which are enlargedconductive lines which supply, through these larger lines, the tworeference voltages to shielding meshes. In particular, power lines 1760and 1762 provide through vias 1763 and 1764 respectively, the referencevoltages to at least two of the conductive lines in the shielding meshof layer 1705. It will be appreciated that each power line in the layer1704 may feed multiple reference voltage lines in the underlying layer1705. For example, a power line on layer 1704 running perpendicular tothe lines in layer 1705 may provide multiple connections throughmultiple vias to all or some of the corresponding reference voltagelines on the underlying layer 1705. The layer 1702 which is disposedunder the layer 1703 also provides through enlarged power linesconnections to lines in the shielding mesh in layer 1703. In particular,power lines 1766 and 1768 provide a lower resistance conductive path forthe reference voltages to their respective lines in the shielding meshof layer 1703. This is unlike the configuration shown in FIG. 15 inwhich the power rings are disposed within the same layers as theshielding mesh itself.

FIG. 41 shows another embodiment of a shielding mesh 1801 which may beused in an integrated circuit. In the top level view of FIG. 41, a twolayer shielding mesh includes a first set of reference voltage lines1808, 1809, 1810, and 1811 on one layer of the integrated circuit and asecond set of reference voltage lines 1803, 1804, 1805, 1806, and 1807on a second layer of the integrated circuit. The reference voltage line1805 is shown as two parts 1805A and 1805B because this referencevoltage line has been broken into two parts in a manner which is similarto the reference voltage line 1404 shown in FIG. 34A which is brokeninto two parts 1404A and 1404B shown in FIG. 34B. The break in thereference line creates an opening 1827 which allows the signal line 1817to have an enlarged portion of that signal line routed into the opening1827. This enlarged portion 1817A includes two connection vias 1829 and1830 which are used to couple the line 1817 to the signal line 1815 inthe other layer as shown in FIG. 41. Two other signal lines are alsoshown in the shielding mesh (signal lines 1821 and 1819) as well assignal line 1823. These other lines are also routed through theshielding mesh. The ability to provide two connection vias within theshielding mesh increases the current carrying capacity in the transitionbetween one layer to another layer. The enlarged portion of the signalline 1817A allows for the use of multiple connection vias to allow thisinterconnection to occur with less resistance. The architecture shown inFIG. 41 may be intentionally designed in cases where signals need tohave low resistance and where it is possible to break a referencevoltage line in a shielding mesh, such as the reference voltage line1805 which is broken into two portions 1805A and 1805B.

FIG. 42 shows another example of a shielding mesh in an integratedcircuit. In the perspective view of the multiple layers of the shieldingmesh shown in FIG. 42, the shielding mesh includes a first group ofreference voltage lines in the layer 1863 and a second group ofreference voltage lines in the layer 1862. Signal lines may be routedthrough these shielding meshes in the manner described herein. Anadditional layer 1861 includes enlarged reference voltage lines whichprovide a lower resistance path in order to supply the referencevoltages to the reference lines in the shielding mesh.

FIG. 43 shows a flowchart which illustrates another aspect of theinventions described herein. In an exemplary method of this aspect whichis shown in FIG. 43, operation 1901 determines, in an optimizationprocess, that there is a need to speed up a first signal line which isin a shielding mesh. If this need exists, then in operation 1903 thecomputer aided design system can determine whether a shielding wire,such as a first or second reference voltage line in a shielding mesh,can be removed, where this shielding wire separates the first signalline which needs to be speeded up from a second signal line. This can bedetermined by, for example, examining the transition times of thesignals appearing on the first signal line and the second signal line.If these transition times do not overlap or differ by more than apredetermined period of time, the shield wire may be deleted. This willallow for the increase in the speed of signal transmission on at leastone of these two signal lines. FIG. 43 illustrates another aspect of theinventions which indicates a difference in philosophy in designing anintegrated circuit. Prior art systems often do not provide shieldinginitially in a design. Rather, prior art methods typically determine ifthere is a signal integrity problem and if there is, then these priorart techniques add the shielding (in order to try to fix the signalintegrity problem) after determining there is a signal integrityproblem. According to one aspect of the inventions described herein,some of the methods described use a “safe” approach in which theshielding mesh is added at the beginning of the design process and wiresare routed in the shielding mesh and then the shielding mesh isselectively altered by deleting shielding lines in the shielding mesh,creating openings in the shielding lines, etc.

FIG. 44 is a flowchart illustrating an exemplary method according toanother aspect of the inventions. In this method, which may be part ofan optimization process, it is determined whether unshielded signalsneed to be shielded in operation 1925. If such unshielded signals doexist, then in operation 1927, the computer aided design system searchesfor neighboring signals within a shielding mesh that do not transitionwithin about the same time. These neighboring signals may then be movedin operation 1929 out of the shielding mesh in order to allow thepreviously unshielded signals to be placed into the shielding mesh.

Although some examples of the present invention are illustrated withshielding meshes that are aligned with a substrate grid, the wires of ashielding mesh may not aligned with any grid. Further, the wires of ashielding mesh within a layer do not have to run in a same direction. Arouter can introduce the shielding mesh into the substrate while routingthe signal wires; and, a shielding mesh may evolve during a routineoperation as the router introduces new shielding wires, combinesshielding wires and tracks in between, removes some shielding wires forrouting signals, etc.

In one embodiment of the present invention, a fully connected power andground shielding mesh can be used to remove capacitive and inductivecoupling. The main sources for this mesh are the main power grid trunks,independent power and ground trunks, and/or other reference voltagesstabilized for shielding, where they are relatively noiseless. Ashielding mesh can also be connected to more than two referencevoltages.

The shielding mesh can also be used in standard cells or gate arrayrouting areas, routing channels or routing channels on top of hardmacros, data bus routing, control bus routing, address bus routing,analog signal routing, clocks and clock bus routing, or any other signallines. It will be appreciated that, normally, the reference voltages(and the lines carrying the reference voltages) are not intended tofluctuate over time; that is, these lines are intended to haverelatively stable voltages over time. Signal lines, on the other hand,are intended (and expected) to fluctuate over time as a result of theoperation of the circuit.

With two or more interwoven meshes, each of which is fully connected andenergized at two or more reference voltages, the automated chip routingcan be much more worry-free; and the signal integrity problems due tocapacitive and inductive coupling can be virtually eradicated.

While most embodiments of the present invention are intended for use insystems containing signal routing software (e.g. place and route systemsor physical synthesis systems), the invention is not necessarily limitedto such use. Although use of other languages and computer programs ispossible (e.g. a computer program may be written to describe hardwareand thus be considered an expression in an HDL and may be compiled orthe invention, in some embodiments, may allocate and reallocate a logicrepresentation, e.g. a netlist, which was created without the use of anHDL), embodiments of the present invention have been described in thecontext of use in HDL synthesis systems and physical synthesis systems,and particularly those designed for use with integrated circuits whichhave vendor-specific technology/architectures. As is well known, thetarget architecture is typically determined by a supplier ofprogrammable ICs. Examples of target architecture are the structuredASIC targets such as NEC's ISSP (Instant Silicon Solution Platforms)devices and LSI Logic's Rapid Chip devices. For certain preferredembodiments, the present invention may be employed withapplication-specific integrated circuits (ASICs).

In the foregoing specification, the invention has been described withreference to specific exemplary embodiments thereof. It will be evidentthat various modifications may be made thereto without departing fromthe broader spirit and scope of the invention as set forth in thefollowing claims. The specification and drawings are, accordingly, to beregarded in an illustrative sense rather than a restrictive sense.

What is claimed is:
 1. A method of designing an integrated circuit, themethod comprising: introducing at least one shielding mesh into arepresentation of a design of the IC; routing representations of signallines in the shielding mesh prior to an optimization which determineswhether signal lines should be shielded, and optimizing the design ofthe IC after the routing, wherein the optimizing comprises removing atleast one shielding wire from the shielding mesh, and wherein theremoving of the at least one shielding wire allows a signal line, whichwas adjacent to the at least one shielding wire, to transmit signalsfaster after the at least one shielding wire is removed, wherein atleast one of the introducing and the optimizing is performed using aprocessor.
 2. The method of claim 1 wherein the shielding mesh comprisesa first plurality of conductive lines for carrying a first referencevoltage and a second plurality of conductive lines for carrying a secondreference voltage.
 3. The method of claim 1, further comprising:determining whether or not a need exists to speed up a first signal linein the shielding mesh.
 4. The method of claim 1, further comprising:determining whether or not a first shielding wire of the shielding meshcan be removed.
 5. The method of claim 1, further comprising: searchingfor neighboring signals within the shielding mesh having differenttransition times.
 6. The method of claim 1, further comprising: movingat least one of the signal lines out of the shielding mesh.
 7. Anon-transitory machine readable medium containing executable computerprogram instructions which when executed by a data processing systemcause the data processing system to perform a method of designing anintegrated circuit, the method comprising: introducing at least oneshielding mesh into a representation of a design of the IC; routingrepresentations of signal lines in the shielding mesh prior to anoptimization which determines whether signal lines should be shielded;and optimizing the design of the IC after the routing wherein theoptimizing comprises removing at least one shielding wire from theshielding mesh, and wherein the removing of the at least one shieldingwire allows a signal line, which was adjacent to the at least oneshielding wire, to transmit signals faster after the at least oneshielding wire is removed.
 8. The medium of claim 7 wherein theshielding mesh comprises a first plurality of conductive lines forcarrying a first reference voltage and a second plurality of conductivelines for carrying a second reference voltage.
 9. The medium of claim 7,further comprising instructions that when executed, case the dataprocessing system to perform operations comprising determining whetheror not a need exists to speed up a first signal line in the shieldingmesh.
 10. The medium of claim 7, further comprising instructions thatwhen executed, case the data processing system to perform operationscomprising determining whether or not a first shielding wire of theshielding mesh can be removed.
 11. The medium of claim 7, furthercomprising instructions that when executed, case the data processingsystem to perform operations comprising searching for neighboringsignals within the shielding mesh having different transition times. 12.The medium of claim 7, further comprising instructions that whenexecuted, case the data processing system to perform operationscomprising moving at least one of the signal lines out of the shieldingmesh.
 13. An integrated circuit comprising: means for introducing atleast one shielding mesh into a representation of a design of the IC;means for routing representations of signal lines in the shielding meshprior to an optimization which determines whether signal lines should beshielded; and means for optimizing the design of the IC after therouting, wherein the optimizing comprises removing at least oneshielding wire from the shielding mesh, and wherein the removing of theat least one shielding wire allows a signal line, which was adjacent tothe at least one shielding wire, to transmit signals faster after the atleast one shielding wire is removed, wherein at least one of the meansfor introducing, routing, and optimizing includes a processor.
 14. Theintegrated circuit of claim 13, further comprising: means for moving atleast one of the signal lines out of the shielding mesh.